Value
Unit
Conditions
Ptot IFSM TJ
Power Dissipation
Peak Forward Surge Current,8.3ms single half sine-wave superimposed on rated load (JEDEC method)
Operating Junction Temperature
200 2.0 150
mW Ta=25 °C (Note 1) A (Note 2) °C
TSTG
Storage Temperature Range
-65 to 150
°C
Rth(j
Key Features
Planar Die construction.
200mW Power Dissipation.
Zener Voltage 3.9v to 75v.
Ideally Suited for Automated Assembly Processes.
RoHS Compliance
Mechanical Data
SOD-323F
Case:
SOD-323F, molded plastic
Epoxy:
Plastic package has UL flammability 94V-0
Terminals:
Solderable per MIL-STD-202G,Method 208
Polarity:
Color band denotes cathode
Approx Weight: 0.0041 grams
Maximum Ratings (T Ambient=25ºC unless noted otherwise)
Symbol.
Full PDF Text Transcription for BZX384C3V9 (Reference)
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BZX384C3V9. For precise diagrams, and layout, please refer to the original PDF.
0.2W Surface Mount Zener Diodes BZX384C3V9 - BZX384C75 0.2W Surface Mount Zener Diodes Features • Planar Die construction • 200mW Power Dissipation • Zener Voltage 3.9v t...
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anar Die construction • 200mW Power Dissipation • Zener Voltage 3.9v to 75v • Ideally Suited for Automated Assembly Processes • RoHS Compliance Mechanical Data SOD-323F Case: SOD-323F, molded plastic Epoxy: Plastic package has UL flammability 94V-0 Terminals: Solderable per MIL-STD-202G,Method 208 Polarity: Color band denotes cathode Approx Weight: 0.0041 grams Maximum Ratings (T Ambient=25ºC unless noted otherwise) Symbol Description Value Unit Conditions *Ptot IFSM TJ Power Dissipation Peak Forward Surge Current,8.3ms single half sine-wave superimposed on rated load (JEDEC method) Operating Junction Temperature 200 2.