BZX55C33 Description
Value Unit Conditions Ptot Power Dissipation at Ta=25°C 500 mW RthJA Junction to Ambient Air 0.3 K/mW VF Max. Forward Voltage 1 V IF=100mA TJ Junction Temperature 175 °C TSTG Storage Temperature Range -65 to +175 °C Note: Valid provided that leads at a distance of 10mm from case are kept at ambient temperature.
BZX55C33 Key Features
- Planar Die Construction
- 500mW Power Dissipation
- Zener Voltage: 2.4V to 75V
- Ideally Suited for Automated Assembly Processes
- RoHS pliant and Halogen Free
- 65 to +175