BZX55C8V2
Description
Value Unit Conditions Ptot Power Dissipation at Ta=25°C 500 mW RthJA Thermal Resistance Junction to Ambient Air 0.3 K/mW VF Max. Forward Voltage 1 V IF=100mA TJ Junction Temperature 175 °C TSTG Storage Temperature Range -65 to +175 °C Note: Valid provided that leads at a distance of 10mm from case are kept at ambient temperature.
Key Features
- Planar Die Construction
- 500mW Power Dissipation
- Zener Voltage: 2.4V to 75V
- Ideally Suited for Automated Assembly Processes
- RoHS compliant and Halogen Free DO-35 Mechanical Data Case: Molded glass DO-35 Terminals: Leads, tin-lead plated solderable per MIL-STD-750, method 2026 Polarity: Color band denotes cathode end Approx Weight: 0.13 gram
