DF2005S
Overview
- Glass passivated chip junction
- Low leakage
- High surge current capability
- Ideal for printed circuit boards DFMS
- Reliable low cost construction utilizing molded plastic technique
- High temperature soldering guaranteed: 260˚C/10 seconds at 5lbs.(2.3kg) tension
- Small size, simple installation
- RoHS compliant Mechanical Data Case: Epoxy: Terminals: Polarity: Weight: DFMS, Molded plastic body over passivated junction Plastic package has UL flammability classification 94V-0 Plated leads solderable per MIL-STD-202, Method 208 As marked on case 0.014 ounce, 0.4 gram
