FEN30AP Datasheet PDF

FEATURES

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● Glass passivated chip junction Low reverse leakage current High forward surge capability Low power loss, high efficiency Low stored charge majority carrier conduction Low forward voltage, high current capability RoHS Compliance TO-3P

MECHANICAL DATA

Case: Epoxy: Terminals: Polarity: Weight: TO-3P, molded plastic body over passivated chips Plastic package has UL flammability classification 94V-0 Plated leads solderable per MIL-STD-750, Method 2026 As marked 0.22 ounce, 6.2 gram

MAXIMUM RATINGS

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ELECTRICAL CHARACTERISTICS

(T A=25ºC unless noted otherwise) Symbol

DESCRIPTION

Maximum Repetitive Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current Peak Forward Surge Current per leg FEN 30AP 50 35 50 FEN 30BP 100 70 100 FEN 30CP 150 105 150 FEN 30DP 200 140 200 Unit V V V Conditions VRRM VRMS VDC IF(AV) 30 A 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) IFSM 300 A TAITRON COMPONENTS INCORPORATED Tel: Fax: (800)-TAITRON (800)-824-8766 (800)-TAITFAX (800)-824-8329 (661)-257-6060 (661)-257-6415 Rev.