S1B Datasheet | Taitron Components

Features - Low profile surface mounted package - Ideal for automated placement - Glass passivated chip junction - Low forward voltage drop - Low leakage current - High forward surge capability - High temperature soldering: 250 °C / 10 seconds at terminals - Ro HS pliant Mechanical Data Case: Epoxy: Terminals: Polarity: Weight: JEDEC DO-214AC(SMA) molded plastic Plastic package has UL flammability classification 94V-0 Solder plated, solderable per MIL-STD-750, Method 2026 Color band denotes cathode end 0.002 ounce, 0.064 gram DO-214AC (SMA) Maximum Ratings (T Ambient=25ºC unless noted) Symbol VRRM VRMS VDC IF(AV) Description Maximum Repetitive Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current S1A S1B S1D S1G S1J 50 100 200 400 600 35 70 140 280 420 50 100 200 400 600 IFSM Peak Forward Surge Current TJ, TSTG Operating...