SACB15 Datasheet PDF

FEATURES

● For surface mounted applications in order to optimize board space
● Low profile package
● Built-in strain relief
● Typical maximum temperature coefficient ∆VBR=0.1%x VBR@25° Cx∆T
● Glass passivated chip junction
● 500W peak pulse power capability at 10x1000µs waveform, repetition rate (duty cycles): 0.01% SMB
● Fast response time: typically less than 1.0ps from 0V to BVmin
● Excellent clamping capability
● Low incremental surge resistance
● High temperature soldering guaranteed: 260°C/40 seconds at terminals
● SACB series is UL recognized under component index. File number E315008
● RoHS Compliant, Halogen-Free

MECHANICAL DATA

Case: JEDEC SMB (DO-214AA), molded plastic body over glass passivated junction Epoxy: Plastic package has UL flammability classification 94V-0 Terminals: Matte Tin-plated leads. Solderable per JESD22-B102D. Polarity: Color band denotes the cathode end Mounting position: Any Weight: 0.003 ounces, 0.093 gram

MAXIMUM RATINGS

(T Ambient=25ºC unless noted o...