SACB8.5
Overview
Peak Pulse Power Dissipation at TA=25° C by 10x1000µs waveform Power Dissipation on Infinite Heat Sink at TL=50° C Peak Pulse Current at TA=25° C by 10x1000µs waveform Typical Thermal Resistance Junction to Lead Typical Thermal Resistance Junction to Ambient Operating Junction and Storage Temperature Range Value 500 3 See.
- For surface mounted applications in order to optimize board space
- Low profile package
- Built-in strain relief
- Typical maximum temperature coefficient ∆VBR=0.1%x VBR@25° Cx∆T
- Glass passivated chip junction
- 500W peak pulse power capability at 10x1000µs waveform, repetition rate (duty cycles): 0.01% SMB
- Fast response time: typically less than 1.0ps from 0V to BVmin
- Excellent clamping capability
- Low incremental surge resistance
- High temperature soldering guaranteed: 260°C/40 seconds at terminals
