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TSP2-XF2012A3 - CHIP LED

Description

This SMD Taping is much smaller than leaded components, thus enable smaller board higher packing density, reduced storage space and finally smaller equipment to be obtained.

Chip Part No.

Features

  • Package in 8mm tape on 7” diameter reel Compatible with automatic placement equipment Compatible with infrared and vapor phase reflow solder process Mono-color type RoHS compliance QSLP2XF2.

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Datasheet Details

Part number TSP2-XF2012A3
Manufacturer TAITRON
File Size 335.26 KB
Description CHIP LED
Datasheet download datasheet TSP2-XF2012A3 Datasheet

Full PDF Text Transcription

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0805 PACKAGE CHIP LED TSP2-XF2012A3 0805 Package Chip LED Features • • • • • Package in 8mm tape on 7” diameter reel Compatible with automatic placement equipment Compatible with infrared and vapor phase reflow solder process Mono-color type RoHS compliance QSLP2XF2 Applications • Automotive: Backlighting in dashboards and switch • Telecommunication: indicator and backlighting in telephone and fax • Flat backlight for LCD, switches and symbols • General Use Descriptions • This SMD Taping is much smaller than leaded components, thus enable smaller board higher packing density, reduced storage space and finally smaller equipment to be obtained. • Light weight makes them ideal for miniature applications Device Selection Guide Chip Part No.
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