Description
Power Dissipation at Ta=25° C Forward Voltage Thermal Resistance Junction to Ambient Junction Temperature Storage Temperature Range Value 500 1.1 0.3 175 -65 to +175 Unit mW V K/mW °C °C Conditions
PD VF RthJA TJ TSTG
IF=200mA
Note: Valid provided that leads at a distance of 10mm from case are ke
Features
- Planar Die Construction 500mW Power Dissipation Very Sharp Reverse Characteristic Very High Stability Low Reverse Current Level Standard Zener Voltage Tolerance is ± 5 % Ideally Suited for Automated Assembly Processes RoHS Compliant
MiniMelf
Mechanical Data
Case: Terminals: Polarity: Weight: Molded Glass MiniMelf Solderable per MIL-STD-202E, Method 208 Color band denotes cathode end Approx. 0.03 grams
Maximum Rati.
ZMM5239B Datasheet
