ADF32T-4R7
Features
- Temperature range up to +125 °C
- Suitable for lead-free reflow soldering as referenced in JEDEC J-STD 020E
- Qualified according to AEC-Q200
- Ro HS-patible
Applications
- Automotive electronics
- High speed bus interfaces
Terminals One-sided tinned terminals
- Base material Cu Sn6
- Layer position Ni, Sn
- Lead-free tinned
Marking
- Marking on ponent:
L value (in µH, coded), date code, pin1 marking
- Minimum data on reel:
Lot number, part number, date of packing
Delivery mode and packing unit
- 12-mm blister tape, wound on 330-mm Ø reel
- Packing unit: 6000 pcs./reel
Please read Cautions and warnings and Important notes at the end of this document.
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Data and signal line chokes mon-mode choke for high speed bus interface, EIA 1210
Dimensional drawing
Layout remendation
Taping and packaging Blister tape
Dimensions in mm
Reel
Dimensions in mm
Please read Cautions and warnings and Important notes at the end of this document.
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Data...
