MMZ1608Y102BT Datasheet | TDK Corporation

FEATURES - Chip bead(impeder), MMZ series offers 5 construction materials. - Size standardized for use by automatic assembly equipment. No preferred orientation. - Either flow or reflow soldering methods can be used due to electroplating of the terminal electrodes. - High reliability due to an entirely monolithic structure. - Closed magnetic circuit structure allows high-density installation while preventing crosstalk between circuits. - Low DC resistance structure of electrode prevents wasteful electric power consumption. - The products contain no lead and also support lead-free soldering. APPLICATIONS PCs, CRTs, liquid crystal display panels, printers, hard disk drives, game machines, cellular phones, etc. PRODUCT IDENTIFICATION MMZ 1608 R 121 A T (1) (2) (3) (4) (5) (6) (1) Series name (2) Dimensions L×W (3) Material code (4) Nominal impedance 121:120Ω at 100MHz (5) Characteristic type (6) Packaging style T:Taping MMZ Series MMZ1608 Type Size: JIS/IEC 1608, EIA 0603 MATERIAL CHARACTERISTICS R material: For wide frequency applications calling for broad impedance characteristics. For digital signal line applications calling requiring good waveform integrity. Impedance values selected for effectiveness at 10 to 200MHz. S material: Standard type that features impedance characteristics similar to those of a typical ferrite core. For signal line applications in which the blocking region is near 100MHz. Impedance values selected for effectiveness at 40 to 300MHz. Y material: High frequency range type intended for the 100MHz region and above. For signal line applications in which the signal frequency is far from the cutoff frequency. Impedance values selected for effectiveness at 80 to 400MHz. A material: This high-impedance product is based on the impedance frequency characteristics of our Y-material. The product offers excellent impedance characteristics, which is greater than 2500Ω , in the vicinity of 100MHz range (MMZ1608A252B). D material: For applications...