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MMZ2012xxxx - (MMZ Series) CHIP BEADFERRITE

This page provides the datasheet information for the MMZ2012xxxx, a member of the MMZ2012Y601B (MMZ Series) CHIP BEADFERRITE family.

Datasheet Summary

Features

  • Chip bead(impeder), MMZ series offers 4 construction materials.
  • Size standardized for use by automatic assembly equipment. No preferred orientation.
  • Either flow or reflow soldering methods can be used due to electroplating of the terminal electrodes.
  • High reliability due to an entirely monolithic structure.
  • Closed magnetic circuit structure allows high-density installation while preventing crosstalk between circuits.
  • Low DC resistance s.

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Datasheet preview – MMZ2012xxxx

Datasheet Details

Part number MMZ2012xxxx
Manufacturer TDK
File Size 106.00 KB
Description (MMZ Series) CHIP BEADFERRITE
Datasheet download datasheet MMZ2012xxxx Datasheet
Additional preview pages of the MMZ2012xxxx datasheet.
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Full PDF Text Transcription

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(1/4) 002-03 / 20040206 / e9412_mmz2012.fm EMC Components Ferrite Beads SMD FEATURES • Chip bead(impeder), MMZ series offers 4 construction materials. • Size standardized for use by automatic assembly equipment. No preferred orientation. • Either flow or reflow soldering methods can be used due to electroplating of the terminal electrodes. • High reliability due to an entirely monolithic structure. • Closed magnetic circuit structure allows high-density installation while preventing crosstalk between circuits. • Low DC resistance structure of electrode prevents wasteful electric power consumption. • The products contain no lead and also support lead-free soldering. APPLICATIONS PCs, CRTs, liquid crystal display panels, printers, hard disk drives, game machines, cellular phones, etc.
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