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MPZ1608S221ATA00 - Chip Beads

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MPZ1608S221ATA00 Applications Commercial Grade Feature Power Line Series MPZ Series / MPZ1608 Type Status Production 1 of 2 Creation Date :February 23 2015 Size Length(L) Width(W) Thickness(T) Recommended Land Pattern (A) Recommended Land Pattern (B) Recommended Land Pattern (C) Electrical Characteristics Impedance at 100MHz Rated Current DC Resistance [Max.] Other Operating Temp. Range (Including Self-Temp. Rise) Soldering Method AEC Q200 Packing Package Quantity Weight 1.60mm +/-0.15mm 0.80mm +/-0.15mm 0.80mm +/-0.15mm 0.60mm Nom. 0.80mm Nom. 0.80mm Nom. 220Ω +/-25% 2.2A 50mΩ -55 to 125degC Reflow, Iron Soldering No Punched (Paper)Taping [180mm Reel] 4000Pcs Min. 0.004g •This PDF document was created based on the data listed on the TDK Corporation website.