MPZ1608S331ATA00
Key Features
- 55 to 125degC Reflow, Iron Soldering No Punched (Paper)Taping [180mm Reel] 4000Pcs Min. 0.004g
- This PDF document was created based on the data listed on the TDK Corporation website
- Part: MPZ1608S331ATA00
- Description: Chip Beads
- Manufacturer: TDK Corporation
- Size: 220.05 KB