Teledyne Technologies S114D
The S114 feature: The Series S114 Surface Mount Centigrid® Relay is an ultraminiature, hermetically sealed, armature relay. The low profile height (.360”) and .100” lead spacing make it ideal for applications where extreme packaging density and/or close PC board spacing are required. The specially formed leads are pre-tinned to make the relays ideal for most types of surface mount solder reflow processes.DESCRIPTION
The basic design and internal construction are identical to the Series 114 Centigrid® relays, and are capable of meeting Teledyne Relays’ T2R® requirements. The following unique construction features and manufacturing techniques provide overall high reliability and excellent resistance to environmental extremes:● All welded construction.
● Unique uni-frame design providing high magnetic efficiency and mechanical rigidity.
● High force/mass ratios for resistance to shock and vibration.
● Advanced cleaning techniques provide maximum assurance of internal cleanliness.
● Precious metal alloy contact material with gold plating assures excellent high current and dry circuit switching capabilities. The Series S114D relays have internal discrete silicon diodes for coil suppression and polarity reversal protection. ENVIRONMENTAL AND PHYSICAL SPECIFICATIONS Temperature (Operating) –55°C to +85°C Vibration (Note 1) 30 g’s to 3000 Hz Shock (Note 1) 50 g’s, 6ms half sine Acceleration 50 g’s Enclosure Hermetically sealed Weight 0.15 oz. (4.3g) max.