• Part: TDG650E30BSP
  • Description: Bottom-side cooled 650 V E-mode GaN transistor
  • Category: Transistor
  • Manufacturer: Teledyne Technologies
  • Size: 1.52 MB
Download TDG650E30BSP Datasheet PDF
Teledyne Technologies
TDG650E30BSP
Features - 650 V enhancement mode power transistor - Bottom-side cooled configuration - RDS(on) = 50 mΩ - IDS(max) = 30 A - Ultra-low FOM Island Technology® die - Low inductance Ga NPX® package - Easy gate drive requirements (0 V to 6 V) - Transient tolerant gate drive (-20 V / +10V) - Very high switching frequency (> 100 MHz) - Fast and controllable fall and rise times - Reverse current capability - Zero reverse recoveryloss - Small 7.1 x 8.5 mm2 PCB footprint - Source Sense (SS) pin for optimized gatedrive - Ro HS 6 pliant - Class one / Level one Production Screening - Lot Acceptance Test options available Package Outline Circuit Symbol Applications - High efficiency power conversion - High density power conversion - ac-dc Converters - Bridgeless Totem Pole PFC - ZVS Phase Shifted Full Bridge - Half & Full Bridge topologies - Synchronous Buck or Boost - Uninterruptable Power Supplies - Space Motor Drives - Solar and Wind Power - Fast Battery Charging - On Board Battery Chargers -...