TEMIC Semiconductors TSC83251G2D
0.5 Um SCMOS3 Technology
DESCRIPTION
............................................................................................................................ 3 2. Technology Information..................................................................................................................... 4 2.1 Wafer Process Technology ................................................................................................................. 4 2.1.1 SCMOS3 0.5um ROM Process ................................................................................................... 4 2.1.2 SCMOS3 NV 0.5um EPROM Process ......................................................................................... 6 2.2 Product Design .................................................................................................................................. 6 2.3 Package Technology .......................................................................................................................... 6 2.3.1 Package description ...................................................................................................................