TOREX SEMICONDUCTOR QFN-24
the QFN-24 is shown in this page. The value of power dissipation varies with the mount board conditions.| Part No. | QFN-24 |
|---|---|
| Datasheet | QFN-24 Download |
| Manufacturer |  TOREX SEMICONDUCTOR |
| Description | Packaging Information / Reference Pattern Layout Dimensions |
| Buy | Stock & Price |
Packaging Information / Reference Pattern Layout Dimensions
●QFN-24
●Packaging Information 1 PIN INDENT Unit: mm 4.0±0.10 0.075 7 8 9 10 11 12 0.40±0.05 6 13 5 14 4 15 3 16 2 17 1 18 24 23 22 21 20 19
●Reference Pattern Layout Dimensions 2.8±0.05 Note : reference metal mask design 0.50 0.50 1.10 2.50 4.50 3.30 0.30 2.70 4.60 3.20 1.10 0.25 Taping Specifications
●QFN-24 Reel Unit: mm 0.8 0.6 0.4 0.2 60±0.5 178.0±0.5 0.8 0.6 0.4 0.2
●Taping Specifications direction of feed R Type :[Device orientation : Right] Standard feed 1.75±0.1 5.5±0.05 (4.35) 12.0±0.3 direction of feed L Type :[Device orientation : Left] Reverse feed
● QFN-24 Power Dissipation Power dissipation data for the QFN-24 is shown in this page. Please use this data as one of reference data taken in the described condition. 1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board Dimensions: 40 x 40 mm (1600mm2) Board Structure: 4 Copper Layers Each layer is 50% connected to the package heat-sink.
●QFN-24
●Packaging Information 1 PIN INDENT Unit: mm 4.0±0.10 0.075 7 8 9 10 11 12 0.40±0.05 6 13 5 14 4 15 3 16 2 17 1 18 24 23 22 21 20 19
●Reference Pattern Layout Dimensions 2.8±0.05 Note : reference metal mask design 0.50 0.50 1.10 2.50 4.50 3.30 0.30 2.70 4.60 3.20 1.10 0.25 Taping Specifications
●QFN-24 Reel Unit: mm 0.8 0.6 0.4 0.2 60±0.5 178.0±0.5 0.8 0.6 0.4 0.2
●Taping Specifications direction of feed R Type :[Device orientation : Right] Standard feed 1.75±0.1 5.5±0.05 (4.35) 12.0±0.3 direction of feed L Type :[Device orientation : Left] Reverse feed
● QFN-24 Power Dissipation Power dissipation data for the QFN-24 is shown in this page. Please use this data as one of reference data taken in the described condition. 1. Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board Dimensions: 40 x 40 mm (1600mm2) Board Structure: 4 Copper Layers Each layer is 50% connected to the package heat-sink.
