MCADRAC4148C7 Description
(2) Wi th a ll diodes conducting, maximum power dissipation per diode = 500mW, l imited by ma ximum junction temperature while ma i ntaining the solder point a t 75°C. (3) Sta ted RθJSP properties assume infinite heatsink. Semelab Limited reserves the right to change test conditions, parameter limits and package dimensions without notice.