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OPB821TX - High Resolution Slotted Optical Switch

General Description

Each OPB821TX device consists of a gallium aluminum arsenide LED and a silicon phototransistor, which are soldered into a printed circuit board and mounted in a high temperature plastic housing on opposite sides of an 0.080” (2.03 mm) wide slot.

Key Features

  • Non-contact switching.
  • Low profile to facilitate stacking.
  • Hermetically sealed components.
  • 24” (609.60 mm) minimum length wire conforms to MIL-W-16878.
  • TX components processed to MIL-PRF-19500.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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High Resolution Slotted Optical Switch OPB821TX Obsolete (OPB821TXV) Features: • Non-contact switching • Low profile to facilitate stacking • Hermetically sealed components • 24” (609.60 mm) minimum length wire conforms to MIL-W-16878 • TX components processed to MIL-PRF-19500 Description: Each OPB821TX device consists of a gallium aluminum arsenide LED and a silicon phototransistor, which are soldered into a printed circuit board and mounted in a high temperature plastic housing on opposite sides of an 0.080” (2.03 mm) wide slot. Lead wires are #24 AWG polytetraflouroethylene (PTFE) insulated, which conforms to MIL-W-16878. Phototransistor switching takes place when an opaque object passes through the slot. For maximum output signal, neither the LED nor the phototransistor is apertured.