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CP201209 - Multilayer Chip Beads

Key Features

  • 1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk. 2.Extremely high reliability due to entirely monolithic construction. 3.Low DC resistance structure of electrode to prevent wasteful electric power consumption. 4.Hing Current rating up to 6A. 5.The products contain no lead and also support lead-free soldering.

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Datasheet Details

Part number CP201209
Manufacturer TaeJin
File Size 1.29 MB
Description Multilayer Chip Beads
Datasheet download datasheet CP201209 Datasheet

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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Multilayer Chip Beads / CP TYPE(Large Current) .Features: 1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk. 2.Extremely high reliability due to entirely monolithic construction. 3.Low DC resistance structure of electrode to prevent wasteful electric power consumption. 4.Hing Current rating up to 6A. 5.The products contain no lead and also support lead-free soldering. .Applications: CP type has a large current funtion for power line due to its low DC resistance, it can generate an impedance down to relative low frequency and cover a wide range of noise suppression. .Product Identification: PIHD □□□□ □ □□□ □ Tolerance Inductance .Shape and Dimension .Schematic Dimensions in mm TYPE CP160808 CP201209 CP321611 CP451616 CP453215 A(mm) 1.6±0.2 2.0±0.