Description
Multiple manufacture source
Multiple manufacture source
Green compound
Define manufacture source
Green compound
Document Number: DS_S1412004
Version: H14
Small Signal Product
PACKAGE OUTLINE DIMENSIONS
B
CA
D
F G
SUGGEST PAD LAYOUT
E H
MARKING
Part No.B0520LW B0530W B0540W
Marking SD SE SF
B0520LW,B0530W,B0540W
Taiwan Semiconductor
DIM.A B C D E F G H
Unit (mm)
Min Max 1.40 1.80 3.55 3.85 0.45 0.70 2.55 2.85 0.95 1.35 0.05 0.15
0.50 REF - 0.10
Unit (inch)
Min Max
0.055
0.071
0
Features
- - Low power loss, high current capability, low VF
- Surface mount device type
- Moisture sensitivity level 1
- Matte Tin (Sn) lead finish with Nickel (Ni) underplate
- Packing code with suffix "G" means
green compound (halogen-free).