FEATURES
- Glass passivated junction chip - Ideal for automated placement - Low profile package - Low power loss, high efficiency - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC - Halogen-free according to IEC 61249-2-21 MECHANICAF DATA Case: SMAF Molding compound: UL flammability classification rating 94V-0 Moisture sensitivity level: level 1, per J-STD-020 Packing code with suffix "G" means green compound (halogen-free) Terminal: Matte tin plated leads, solderable per J-STD-002 Meet JESD 201 class 1A whisker test Polarity: Indicated by cathode band Weight: 35 mg (approximately) SMAF MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(TA=25°C unless otherwise noted) PARAMETER SYMBOL ES1DF ES1GF Maximum repetitive peak reverse voltage VRRM 200 400 Maximum RMS voltage Maximum DC blocking voltage VRMS VDC 140 200 280 400 Maximum average forward rectified current IF(AV) 1 Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load IFSM 30...
Taiwan Semiconductor
