GBPC3504 Datasheet | Taiwan Semiconductor

Features - Glass passivated chip junction - Integrally molded heatsink provide very low thermal resistance for maximum heat dissipation - Typical IR less than 0.2μA - High surge current capability - UL Recognized File # E-326243 - Ro HS pliant APPLICATIONS - Switching mode power supply (SMPS) - AC to DC converter KEY PARAMETERS PARAMETER VALUE UNIT IF VRRM 15, 25, 35 - 1000 IFSM TJ MAX Package 300, 400 °C GBPC Configuration Quad MECHANICAL DATA - Case: GBPC GBPC-W: Wire structure GBPC40-M: Terminal cathode parallel to anode - Molding pound meets UL 94V-0 flammability rating - Terminal: Matte tin plated leads, solderable per J-STD-002 - Meet JESD 201 class 1A whisker test - Mounting torque: 20 in-lbs maximum - Polarity: As marked - Weight: 16.95g (approximately) GBPC...