FEATURES
- Glass passivated chip junction - High current capability, Low VF - High reliability - High surge current capability - Low power loss - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC - Halogen-free according to IEC 61249-2-21 definition SF31G thru SF38G Taiwan Semiconductor MECHANICAL DATA
Case: DO-201AD Molding compound, UL flammability classification rating 94V-0 Base P/N with suffix "G" on packing code - green compound (halogen-free) Base P/N with prefix "H" on packing code - AEC-Q101 qualified Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 1A whisker test with prefix "H" on packing code meet JESD 201 class 2 whisker test Weight: 1.1 g (approximately) DO-201AD MAXIMUM RATINGS
AND ELECTRICAL CHARACTERSTICS (TA=25℃ unless otherwise noted) PARAMETER SF SF SF SF SF SYMBOL 31G 32G 33G 34G 35G Maximum repetitive peak reverse voltage VRRM 50 100 150 200 300 Maximum RMS voltage VRMS 35 70 105 140 210 Maximum DC blockin...
Taiwan Semiconductor
