TS12N20CS Overview
Taiwan Semiconductor’s new low cost, state of the art MicroSurf™ lateral MOSFET process technology in chipscale bondwireless packaging minimizes PCB space and RDS(ON) plus provides an ultra-low Qg X RDS(ON) figure of merit. Patent Pending Internal Block Diagram Ds G D S Standard Application MicroSurf™ for High Frequency DC-DC Converters Bottom:.