Download TSM4946DCS Datasheet PDF
Taiwan Semiconductor
TSM4946DCS
FEATURES - Advance Trench Process Technology - High Density Cell Design for Ultra Low On-resistance - Ro HS pliant - Halogen-free APPLICATIONS - High-Side DC/DC Conversion - Notebook - Sever SOP-8 KEY PERFORMANCE PARAMETERS PARAMETER VALUE UNIT RDS(on) (max) 55 mΩ Qg 21 n C Note: MSL 1 (Moisture Sensitivity Level) per J-STD-020 ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) PARAMETER SYMBOL LIMIT Drain-Source Voltage Gate-Source Voltage ±20 Continuous Drain Current, Silicon limited TC = 25°C Continuous Drain Current (Note 1) TC = 25°C Pulsed Drain Current Total Power Dissipation TA = 25°C TA =...