VSSA310 Overview
Key Features
- Low profile package
- Ideal for automated placement
- Trench MOS Schottky technology
- Low power losses, high efficiency
- Low forward voltage drop
- Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
- Not recommended for PCB bottom side wave mounting
- Compliant to RoHS Directive 2002/95/EC and in accordance to WEEE 2002/96/EC
