THERMAL PERFORMANCE
Michael Speed INTRODUCTION Devices in this package come in a range of on-resistance values, in n-channel and p-channel versions. This technical note discusses pin-outs, package outlines, pad patterns, evaluation board layout, and thermal performance for the dual-channel version. Both n-and p-channel devices are available in this package – the drawing example below illustrates the p-channel device. SOT-363 SC-70 (6-LEADS) S1 1 6 D1 G1 2 5 G2 D2 3 4 S2 PINĆOUT Figure 1 shows the pin-out description and Pin 1 identification for the dual-channel SC-70 device in the 6-pin configuration. Top View FIGURE 1. PACKAGE DIMENSIONS SCĆ70: 6ĆLEADS MILLIMETERS Min Nom Max 0.90 – 0.80 0.15 0.10 1.80 1.80 1.15 1.20 0.10 – – – – – 2.00 2.10 1.25 0.65BSC 1.30 0.20 7_Nom 1.10 0.10 1.00 0.30 0.25 2.20 2.40 1.35 1.40 0.30 Dim 6 5 4 E1 E 1 2 3 -Be e1 D -Ac A2 A L A1 ECN: E-77648—Rev. A, New Issue Min 0.035 – 0.031 0.006 0.004 0.071 0.071 0.045 INCHES Nom Max 0.043 0.004 0.039 0.012 0.010...
Telefunken Microelectronics
