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AN816 Datasheet Dual Channel MOSFET

Manufacturer: Telefunken Microelectronics

Overview: ( DataSheet : .. ) AN816 Vishay Siliconix Dual-Channel LITTLE FOOTR 6-Pin SC-70 MOSFET Copper Leadframe Version Remended Pad Pattern and Thermal Performance Michael Speed INTRODUCTION The new dual 6-pin SC-70 package with a copper leadframe enables improved on-resistance values and enhanced thermal performance as pared to the existing 3-pin and 6-pin packages with Alloy 42 leadframes. These devices are intended for small to medium load applications where a miniaturized package is required. Devices in this package e in a range of on-resistance values, in n-channel and p-channel versions. This technical note discusses pin-outs, package outlines, pad patterns, evaluation board layout, and thermal performance for the dual-channel version. Both n-and p-channel devices are available in this package – the drawing example below illustrates the p-channel device.

General Description

and Pin 1 identification for the dual-channel SC-70 device in the 6-pin configuration.

Top View FIGURE 1.

PACKAGE DIMENSIONS SCĆ70: 6ĆLEADS MILLIMETERS Min Nom Max 0.90 – 0.80 0.15 0.10 1.80 1.80 1.15 1.20 0.10 – – – – – 2.00 2.10 1.25 0.65BSC 1.30 0.20 7_Nom 1.10 0.10 1.00 0.30 0.25 2.20 2.40 1.35 1.40 0.30 Dim 6 5 4 E1 E 1 2 3 -Be e1 D -Ac A2 A L A1 ECN: E-77648—Rev.

Key Features

  • a typical thermal resistance of 75_C/W and a maximum of 90_C/W. o o P D + 150 Co.
  • 25 C 224 CńW P + 558 mW Elevated Ambient 60_C PD + T J(max).
  • T A Rq JA o o P D + 150 Co.
  • 60 C 224 CńW P D + 402 mW Power Dissipation The typical RθJA for the dual-channel 6-pin SC-70 with a copper leadframe is 224_C/W steady-state, compared to 413_C/W for the Alloy 42 version. All figures are based on the 1-inch2 FR4 test board. The following example shows how the thermal resistance impacts power.

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