F60UP30DN Description
F60UP30DN using the lastest FRED FAB process(planar passivation chip) with ultrafast and soft recovery characteristic. 300 0.96 0.85 35 26 Typ 0.8 Max. Units 1.20 V 1.00 10 µA 100 45 ns 40 Units ℃/W Rev.08T © 1995 Thinki Semiconductor Co., Ltd.