UF5408
Overview
- Plastic package has Underwriters Laboratory F l a m m a b i l i t y C l a s s i f i c a t i o
- 9 4 V- 0
- Glass passivated chip junction
- Low cost
- Ultrafast recovery time for high efficiency
- H i g h c u r r e n t c a pa b i l i t y, l o w f o r w a r d v o l ta g e
- High surge capability
- Low leakage
- High temperature soldering guaranteed: 250℃/10 sec, 0.375”(9.5mm) lead length, 5lbs. (2.3kg) tension Mechanical Data
- Case: Molded plastic body, JEDEC DO-201AD
