314AG19DC Datasheet | Thomas

FEATURES : The Augat 300C Series dual wipe contact adds a new family of product to Augat's low cost DIP socket line. - Closed bottom prevents solder wicking - Standoff's facilitate board cleaning - Low profile design - Recognized under the ponent Program of Underwriters ® Laboratories, Inc. File No. E111362 PERFORMANCE SPECIFICATIONS: MECHANICAL Vibration Passed MIL-STD-1344, Method 2005.1, Condition III, 15 G’s Shock Passed MIL-STD-1344, Method 2004.1, Condition G, 100 G’s Durability Passed MIL-STD-1344, Method 2016 Normal Force 170 Grams (6.0 oz.) with .009" x .015" (0,23 x 0,38) IC lead typ. Contact Retention 340 Grams (12.0 oz.) minimum Solderability Passed MIL-STD-202, Method 208 Insertion Force 169 Grams (6.0 oz.) average with a .013"x .020" (0,33 x 0,51) dia. polished steel pin Withdrawal Force 43 Grams (1.5 oz.) average with a .009" x .015" (0,23 x 0,38) dia. polished steel pin ELECTRICAL Contact Resistance 10 Milliohms Contact Rating 2 Amps Capacitance .5 p F per MIL-STD-202, Method 305 (Adjacent contacts max.) Insulation Resistance .... 5,000 Megohms @ 500 VDC per MIL-STD-1344, Method 3003.1 Dielectric Withstanding Voltage 1,000 Volts RMS per MIL-STD-1344, Method 3001 ENVIRONMENTAL Humidity Passed MIL-STD-1344, Method 1002.2 Thermal Shock Passed MIL-STD-1344, Method 1003.1 Temperature Cycling .... Passed MIL-STD-1344, Method 1003.1 Operation Temperature .. Gold -55°C to +125°C Tin -55°C to +105°C Salt Spray Passed MIL-STD-1344, Method 1001.1 APPLICATION DIMENSIONS: - PCB Thickness Range: Standard .062" and .092" (1,57 and 2,34)) - PCB Hole Size Range: .035" ± .003" (0,89 ± 0,08) standard tail - IC Pin Dimension Range: .008" x .015" ( 0,20 x 0,38) through .013" x .020" (0,33 x...