FBGA96T.5-DC144 Overview
62/36/2 Sn63 SnPbAg Substrate Substrate Material: FR4 Flex laminate Polyimide Daisy Chain by internal wire bonding PACKAGING TRAYS Tray BGATRAY8mm Tray Quantity 360 ©2002 TopLine All Rights Reserved Rev 8/02 Page 2 of 2.
This datasheet includes multiple variants, all published together in a single manufacturer document.
| Part number | FBGA96T.5-DC144 |
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| Datasheet | FBGA96T.5-DC144 FBGA96T5-DC144 Datasheet (PDF) |
| File Size | 69.79 KB |
| Manufacturer | TopLine |
| Description | FBGA96T.5-DC144 |
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62/36/2 Sn63 SnPbAg Substrate Substrate Material: FR4 Flex laminate Polyimide Daisy Chain by internal wire bonding PACKAGING TRAYS Tray BGATRAY8mm Tray Quantity 360 ©2002 TopLine All Rights Reserved Rev 8/02 Page 2 of 2.
| Part Number | Description |
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