TB6674PG
Key Features
- solder bath temperature: 230℃
- dipping time: 5 seconds
- the number of times: once
- use of R-Type flux (2)Use of Sn-3.0Ag-0.5Cu solder Bath
- solder bath temperature: 245℃
- use of R-type flux TB6674FAG TB6674FG Weight DIP16-P-300-2.54A: 1.11 g (typ.) HSOP16-P-300-1.00: 0.50 g (typ.) SSOP16-P-225-1.00A: 0.14 g (typ.) 1 Ver.3
