TCK22893G
feature a thermal shut down function and output auto-discharge function.
These devices are available in 0.4 mm pitch ultra small package WCSP6E (0.8 mm x 1.2 mm, t: 0.55 mm). So these devices are ideal for portable applications that require high-density board assembly such as cellular phone.
Feature
- Over current limit function
ICL = 400/740/1110/1540 m A (Option)
- Thermal shutdown function
- Inrush current reduction
- Output auto-discharge function
- True reverse current blocking function(Option)
- Under voltage lockout function(Option)
- Low ON resistance :
RON = 31 mΩ (typ.) at VIN = 5.0 V, IOUT = -0.15 A RON = 40 mΩ (typ.) at VIN = 3.3 V, IOUT = -0.15 A RON = 70 mΩ (typ.) at VIN = 1.8 V, IOUT = -0.15 A
- Low quiescent current: IQ = 25 μA (typ.) at VIN = 5.5 V, IOUT = 0 m A
- Pull down connection between CONTROL and GND
- Ultra small package : WCSP6E (0.8 mm x 1.2 mm, t: 0.55 mm)
WCSP6E Weight: 1 mg (typ.)
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- 2019 Toshiba Electronic Devices & Storage Corporation
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