THGBMDG5D1LBAIL Overview
THGBMDG5D1LBAIL 4GB THGBMDG5D1LBAIL TOSHIBA e-MMC Module INTRODUCTION THGBMDG5D1LBAIL is 4GB density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBMDG5D1LBAIL has an industry standard MMC protocol for easy use.