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TLP109-IGM Datasheet Photocouplers Photorelay

Manufacturer: Toshiba

Overview: Photocouplers Infrared LED & Photo IC TLP109(IGM) TLP109(IGM) 1. Applications • Intelligent Power Module Signal Isolation • High-Speed Digital Interfacing for Instrumentation and Control Devices • Industrial Inverters 2. General The Toshiba TLP109(IGM) mini-flat coupler is a small-outline coupler suitable for surface-mount assembly. The TLP109(IGM) consists of an infrared LED optically coupled to a high-speed photodiode-transistor chip. The TLP109(IGM) is housed in the SO6 package and guarantees a creepage distance of ≥5.0 mm, a clearance of ≥5.0 mm and an insulation thickness of ≥0.4mm. Therefore, the TLP109(IGM) meets the reinforced insulation class requirements of international safety standards. The TLP109(IGM) guarantees minimum and maximum of propagation delay time, switching time dispersion, and high common mode transient immunity. Therefore TLP109 (IGM) is suitable for isolation interface between IPM(Intelligent Power Module) and control IC circuits in motor control application. 3.

Key Features

  • (1) Isolation voltage: 3750 Vrms (min) (2) Common-mode transient immunity: 10 kV/µs (min) @VCM = 1500 Vp-p (3) Propagation delay time tpHL/tpLH = 0.1 µs (min) = 0.8 µs (max) @ IF = 10 mA, VCC = 15 V, RL = 20 kΩ, Ta = 25  (4) Pulse width distortion: 0.7 µs (max) (|tpHL-tpLH|) (5) TTL compatible (6) Safety standards UL-recognized: UL 1577, File No. E67349 cUL-recognized: CSA Component Acceptance Service No.5A File No. E67349 VDE-approved: EN 60747-5-5, EN 62368-1 (Note 1) CQC-approved: GB4943.1, GB.