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TLP181 Datasheet PDF

Toshiba TLP181

TLP181 is a small outline coupler, suitable for surface mount assembly. Since TLP181 is smaller than DIP package, it’s suitable for highdensity surface mounting applications such as programmable controllers.
Part No. TLP181
Datasheet TLP181 Download
Manufacturer
Toshiba
Description Photocoupler
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TLP181 datasheet page 1 preview

ABSOLUTE MAXIMUM RATINGS

(Ta = 25°C) TLP181 Characteristic Symbol Rating Unit Forward current Forward current detating (Ta ≥ 89°C) Pulse forward current (100μs pulse, 100pps) LE D Reverse voltage Diode power dissipation Diode power dissipation derating (Ta ≥ 89°C) Junction temperature Collector-emitter voltage Emitter-collector voltage Detector Collector current Collector power dissipation Collector power dissipation derating (Ta ≥ 25°C) Junction temperature Storage temperature range Operating temperature range Lead soldering temperature (10 s) Total package power dissipation Total package power dissipation derating (Ta ≥ 25°C) Isolation voltage (AC, 60 s, R.H. ≤ 60 %) (Note 1) IF ΔIF/°C IFP VR PD ΔPD/°C Tj VCEO VECO IC PC ΔPC/°C Tj Tstg Topr Tsol PT ΔPT/°C BVS 50 -1.4 1 5 100 -2.8 125 80 7 50 150 -1.5 125 -55 to 125 -55 to 110 260 200 -2.0 3750 mA mA/°C A V mW mW/°C °C V V mA mW mW/°C °C °C °C °C mW mW/°C Vrms Note: Using continuously under heavy loads (e.g. the application of high te...
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