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TLP700AF Datasheet Photocoupler

Manufacturer: Toshiba

Overview: Photocouplers Infrared LED & Photo IC TLP700AF TLP700AF 1. Applications • Industrial Inverters • Air Conditioner Inverters • MOSFET Gate Drivers • IGBT Gate Drivers • Induction Cooktop and Home Appliances 2. General The TLP700AF is a photocoupler in a 6-pin SDIP package that consists of an infrared LED optically coupled to an integrated high-gain, high-speed photodetector IC chip. It provides guaranteed performance and specifications at temperatures up to 110. The TLP700AF is physically smaller than the one in an 8-pin DIP package and pliant with international safety standards for reinforced insulation. It thus provides a smaller footprint solution for applications that require safety standard certification. An internal noise shield provides a guaranteed monmode transient immunity of ±20 kV/µs. It is ideal for IGBT and power MOSFET gate drive. Leads of the TLP700AF is bend to satisfy 8 mm PC board spacing requirements. Absolute maximum ratings and electrical characteristics are the same as in the TLP700A. 3.

Key Features

  • (1) Buffer logic type (totem pole output) (2) Output peak current: ±2.5 A (max) (3) Operating temperature: -40 to 110 (4) Supply current: 3 mA (max) (5) Supply voltage: 15 to 30 V (6) Threshold input current: 5 mA (max) (7) Propagation delay time: 200 ns (max) (8) Common-mode transient immunity: ±20 kV/µs (min) (9) Isolation voltage: 5000 Vrms (min) (10) Safety standards UL-recognized: UL 1577, File No. E67349 cUL-recognized: CSA Component Acceptance Service No.5A File No. E67349 VDE-approved: EN.

TLP700AF Distributor