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Surface Mount LED TLPGE1005B
Features 3.2 (L) x 2.4 (W) x 2.4 (H) mm 2 mm lens top type InGaAlP LED Reflow soldering is possible Standard embossed taping 4 mm pitch : T03 (1000 pcs/reel)
Applications High−output backlighting source Battery−powered equipment Message boards Portable devices Computer peripherals
Maximum Ratings (Ta=25 C)
Characteristic Forward Current Reverse Voltage Power Dissipation Operating Temperature Storage Temperature Soldering Temperature Soldering Time Symbol IF VR PD Topr Tstg Tsol − Max. 25 4.00 60.00 −40 ~ 85 −40 ~ 100 260 for 3 sec.