TLWLF1100D Datasheet | Toshiba

Features (1) (2) (3) (4) (5) (6) (7) (8) (9) Size: 3.2 (L) mm × 2.9 (W) mm × 1.9 (H) mm Luminous intensity: IV = 1400 mcd (typ.) @IF = 20 m A LED chip and phosphor Emitting material: In Ga N Color: White (Warm White) High heat-resistant type: Topr/Tstg = -40 to 100 Designed to be mounted with automatic pick-and-place equipment Reflow soldering is possible Standard embossed tape packing: 4-mm pitch: T11 type (2,000 pcs/reel), 8-mm tape/reel 3. Packaging and Internal Circuit http://..net/ 1: Anode 2: Cathode 4-3V1S 2012-02-24 Rev.1.0 datasheet pdf - http://..net/ TLWLF1100D(T11 4. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25) Characteristics Forward current (DC) Reverse voltage Power dissipation Operating temperature Storage temperature Symbol IF VR PD Topr Tstg Note See Fig. 4.1 Max 30 5 120 -40 to 100 -40 to 100 Unit m A V m W   Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). http://..net/ Fig. 4.1 Forward Current Derating, IF - Ta 5. Handling Precautions - ESD withstand voltage according to MIL STD 883D, Method 3015.7: ≥ 1000 V When handling this LED, take the following measures to prevent the LED from being damaged or otherwise adversely affected. 1. Use a conductive tablemat and conductive floor mat, and ground the workbench and floor. 2. Operators handling laser diodes must be grounded via a high resistance (about 1 MΩ). A conductive strap is good for this purpose. 3. Ground all tools...