TMP87CH74AFG Datasheet | Toshiba

TOSHIBA Original CMOS 8-Bit Microcontroller TLCS-870 Series TMP87CH74AFG TMP87CM74AFG Semiconductor pany TMP87CH74A/M74A Document Change Notification ç ç The purpose of this notification is to inform customers about the launch of the Pb-free version of the device. The introduction of a Pb-free replacement affects the datasheet. Please understand that this notification is intended as a temporary substitute for a revision of the datasheet. Changes to the datasheet may include the following, though not all of them may apply to this particular device. ç 1. Part number Example: TMPxxxxxx F ˠ TMPxxxxxx FG All references to the previous part number were left unchanged in body text. The new part number is indicated on the prelims pages (cover page and this notification). ç 2. Package code and package dimensions Example: LQFP100-P-1414-0.50C ˠ LQFP100-P-1414-0.50F All references to the previous package code and package dimensions were left unchanged in body text. The new ones are indicated on the prelims pages. ç 3. Addition of notes on lead solderability Now that the device is Pb-free, notes on lead solderability have been added. ç 4. RESTRICTIONS ON PRODUCT USE The previous (obsolete) provision might be left unchanged on page 1 of body text. A new replacement is included on the next page. ç 5. Publication date of the datasheet The publication date at the lower right corner of the prelims pages applies to the new device. 2008-03-06 TMP87CH74A/M74A 1. Part number 2. Package code and dimensions Previous Part Number Previous Package Code (in Body Text) (in Body Text) New Part Number New Package Code TMP87CH74AF TMP87CM74AF QFP80-P-1420-0.80B QFP80-P-1420-0.80B TMP87CH74AFG TMP87CM74AFG QFP80-P-1420-0.80B QFP80-P-1420-0.80B TMP87PM74FG TMP87PM74FG - : For the dimensions of the new package, see the attached Package Dimensions diagram. 3. Addition of notes on lead solderability The following solderability test is conducted on the new device. Lead...