TMP95C061BDFG Datasheet | Toshiba

TOSHIBA Original CMOS 16-Bit Microcontroller TLCS-900/H Series TMP95C061BFG TMP95C061BDFG Semiconductor pany TMP95C061B Document Change Notification ç ç The purpose of this notification is to inform customers about the launch of the Pb-free version of the device. The introduction of a Pb-free replacement affects the datasheet. Please understand that this notification is intended as a substitute for a revision of the datasheet. Changes to the datasheet may include the following, though not all of them may apply to this particular device. ç 1. Part number Example: TMPxxxxxx F ˠ TMPxxxxxx FG All references to the previous part number were left unchanged in body text. The new part number is indicated on the prelims pages (cover page and this notification). ç 2. Package code and package dimensions Example: LQFP100-P-1414-0.50C ˠ LQFP100-P-1414-0.50F All references to the previous package code and package dimensions were left unchanged in body text. The new ones are indicated on the prelims pages. ç 3. Addition of notes on lead solderability Now that the device is Pb-free, notes on lead solderability have been added. ç 4. RESTRICTIONS ON PRODUCT USE The previous (obsolete) provision might be left unchanged on page 1 of body text. A new replacement is included on the next page. ç 5. Publication date of the datasheet The publication date at the lower right corner of the prelims pages applies to the new device. 2011-01-26 TMP95C061B 1. Part number 2. Package code and dimensions Previous Part Number Previous Package Code (in Body Text) (in Body Text) New Part Number New Package Code TMP95C061BF - (Note) P-QFP100-1414-0.50 - (Note) TMP95C061BFG TMP95C061BDFG QFP100-P-1414-0.50 LQFP100-P-1414-0.50F Note: Pb-containing variant not available. - : For the dimensions of the new package, see the attached Package Dimensions diagram. 3. Addition of notes on lead solderability The following solderability test is conducted on the new device. Solderability...