TGS2303

TGS2303 Key Features

• Vertical PIN Monolithic Process 0.2-18 GHz Frequency Range 0.5 dB Insertion Loss, Typical 35 dB Isolation, Typical 20 dB
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• Use AuSn (80/20) solder with limited exposure to temperatures at or above 300-C (30 seconds max). An alloy station or co
• Vacuum pencils and/or vacuum collets are the preferred method of pick up. Air bridges must be avoided during placement.