TQHBT Overview
TriQuint’s TQHBT process is a highly reliable InGaP HBT process with three levels of interconnecting metal. Thick metal interconnects and high quality passives promote integration. The thick metal interconnects, which promote enhanced thermal management, and high density capacitors keep die sizes small.
TQHBT Key Features
- Dielectric Metal 1
- 2um Dielectric
- Sub Collector Isolation Implant Buffer & Substrate
- TQHBT Process Cross-Section
