TQQ2504 Datasheet | TriQuint Semiconductor

Features - BAW and SAW technology - High cross isolation - Single-ended (SE) 50 Ohm Rx & Tx ports - Performance -30 to +90 ºC - Low insertion loss - Ro HS pliant, Pb-free 15 Pin 3.6 x 2.0 mm leadless package Functional Block Diagram General Description The TQQ2504 is a high-performance Bulk Acoustic Wave (BAW) and Surface Acoustic Wave (SAW) quadplexer bank module designed to meet the strict LTE requirements suitable for carrier aggregation applications. Band 25 uses BAW technology and Band 4 uses SAW technology within one module. TQQ2504 is specifically designed to meet the high performance expectations of insertion loss, cross isolation and linearity for LTE systems applications under all operating conditions. The TQQ2504 uses mon module packaging techniques to achieve the industry standard 3.6 x 2.0 x 0.9 mm footprint. The quadplexer band module exhibits excellent power handling capabilities. Pin Configuration - Single Ended Pin No. 1 4 8 11 13 2,3,5,6,7,9,10,12,14,15 Label Band 4 Rx Band 25 Rx Band 4 Tx Band 25 Tx Antenna GND Ordering Information Part No. TQQ2504-EVB Description Product description Evaluation board description Preliminary Data Sheet: Rev - 12/15/2013 © 2013 Tri Quint Semiconductor, Inc. Page 1 of 8 Disclaimer: Subject to change without notice e Connecting the Digital World to the Global Network...