TQRLC Datasheet | TriQuint Semiconductor

Production Released Process .. Advanced Passives Foundry Foundry Service Service Ga As MESFET Features - - TQRLC TQTRx - - - - - - Thick 4 Layer Metal; > 9 µm total thickness High Density Interconnects: - 3 Global - 1 Local High-Q Passives; Inductor Q >50 @ 2 GHz Low Cost: Passives Only Thin Film Resistors Dielectric Encapsulated Metals Planarized Surface; simplified plastic packaging Volume Production Process TQRLC TQTRx Process Cross-Section Applications - General Description Tri Quint’s TQRLC is a pure passives process. It is targeted at high performance, small size passive-only circuits and utilizes over 9 µm of gold metal. High density interconnections are acplished with three thick global and one surface metal interconnect layers. The four metal layers are encapsulated in a high performance, low dielectric constant material that allows wiring flexibility and plastic packaging simplicity. Precision Ni Cr resistors, inductors, and high value MIM capacitors are available. The process is based on the TQTRx process, currently Tri Quint’s highest volume process. The TQRLC process is available on 150-mm (6 inch) wafers. - - - - Passive ponents: - Phase Shifters - Baluns - Transformers - Couplers - Mixers (with off-chip diode arrays) Circuits Requiring High-Q Passive Elements Matching Circuits RF Module Front-End Filters General RF and Microwave Impedance Matching Tri Quint Semiconductor Tri Quint Semiconductor 2300 NE Brookwood Pkwy 2300 NE Brookwood Pkwy Hillsboro, Oregon 97124 Hillsboro, Oregon 97124 Semiconductors for munications .triquint. Page Page1 1of of7; 3;Rev Rev1.0 2.311/15/01 3/18/04 Phone: 503-615-9000 Phone: 503-615-9000 Fax: 503-615-8905 Fax: 503-615-8905 Email: info@triquint. Email: info@triquint. Production Released...