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DS54-0003 - Low Cost Four-way SMT Power Splitter/Combiner

Description

M/A-COM’s DS54-0003 is an IC-based monolithic power splitter/combiner in a low cost SOW-16 plastic package.

This device is ideally suited for applications where PCB real estate is at a premium and standard packaging for automated assembly and low cost are critical.

Features

  • Low Cost Small Size and Low Profile Industry Standard SOW-16 SMT Plastic Package Excellent Repeatability (Lot-to-Lot Variation) Typical Isolation: 23 dB Typical Amplitude Balance: 0.3 dB Typical Insertion Loss: 1.0 dB Commercial and Military GPS and LEO Frequency Coverage DS54-0003 V3 SOW-16.

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Datasheet preview – DS54-0003

Datasheet Details

Part number DS54-0003
Manufacturer Tyco Electronics
File Size 137.54 KB
Description Low Cost Four-way SMT Power Splitter/Combiner
Datasheet download datasheet DS54-0003 Datasheet
Additional preview pages of the DS54-0003 datasheet.

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Other Datasheets by Tyco Electronics
  • DS54-0001 - Low Cost Four-Way SMT Power Splitter/Combiner/ 824-960 MHz
  • DS54-0002 - Low Cost Four-Way SMT Power Splitter/ Combiner 1700-2000 MHz
  • DS54-0005 - Low Cost Four-Way GMIC SMT Power Divider 824 . 960 MHz
  • DS54-0006 - Four Way SMT Power Splitter/Combiner 1700 - 2000 MHz
  • DS52-0001 - Low Cost Two-Way SMT Power Divider 824-960 MHz
  • DS52-0002 - Low Cost Two-Way SMT Power Divider 1920- 2170 MHz
  • DS52-0004 - Low Cost Two-Way SMT Power Diveder 1510-1660MHz
  • DS52-0005 - Low Cost Two-Way SMT Power Divider 1700 - 1900 MHz

Full PDF Text Transcription

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Low Cost Four-way SMT Power Splitter/Combiner, 1200 - 1660 MHz Features • • • • • • • • Low Cost Small Size and Low Profile Industry Standard SOW-16 SMT Plastic Package Excellent Repeatability (Lot-to-Lot Variation) Typical Isolation: 23 dB Typical Amplitude Balance: 0.3 dB Typical Insertion Loss: 1.0 dB Commercial and Military GPS and LEO Frequency Coverage DS54-0003 V3 SOW-16 Description M/A-COM’s DS54-0003 is an IC-based monolithic power splitter/combiner in a low cost SOW-16 plastic package. This device is ideally suited for applications where PCB real estate is at a premium and standard packaging for automated assembly and low cost are critical.
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