Datasheet4U Logo Datasheet4U.com

FR21-0001 - Dual Junction Drop-In Isolator

General Description

M/A-COM’s drop-in isolators, designed for cellular applications, feature high performance at low cost.

These designs offer the best isolation per insertion loss ratio in the industry and are currently produced in the tens of thousands of pieces per year.

Key Features

  • 50 dB Isolation Typical, 0.40 dB Insertion Loss Typical Custom Products Available with Alternate Configurations such as Couplers, Attenuators, Higher Power Terminations, Reverse Circulation and Termination on Ports 1 or 2 Designed for Wireless Telecommunications Systems: AMPS, N-AMPS, D-AMPS FR21.

📥 Download Datasheet

📁 Similar Datasheet

Part Number Description Manufacturer
FR21 (FR2x) Fast Efficient Rectifiers FCI Semiconductor
FR210 2A Leaded Type Fast Rectifiers CITC
FR210 Fast Efficient Rectifiers FCI Semiconductor
FR2 Dyad Clare .
FR20 Fast Efficient Rectifiers FCI Semiconductor

Other Datasheets by Tyco Electronics (now TE Connectivity)

Part Number Description
FR21-0002 Dual Junction Drop-In Isolator
FR21-0003 Dual Junction Drop-In Isolator
FR21-0004 Dual Junction Drop-In Isolator

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
FR21-Series Dual Junction Drop-In Isolator Features • • • 50 dB Isolation Typical, 0.40 dB Insertion Loss Typical Custom Products Available with Alternate Configurations such as Couplers, Attenuators, Higher Power Terminations, Reverse Circulation and Termination on Ports 1 or 2 Designed for Wireless Telecommunications Systems: AMPS, N-AMPS, D-AMPS FR21 Description M/A-COM’s drop-in isolators, designed for cellular applications, feature high performance at low cost. These designs offer the best isolation per insertion loss ratio in the industry and are currently produced in the tens of thousands of pieces per year. These units can be ordered so as to be compatible with solder reflow manufacturing techniques.